Samsung has confirmed that the highly anticipated flagship devices are slated to launch at its Unpacked event on 21 February in Barcelona, Spain. The event will take place just ahead of the Mobile World Congress tat will be held from Feb 22 to 25, 2016.
The company has also released a teaser video that shows a man using a Gear VR headset giving a glimpse of an unpacked box. This could also mean the company plans on adding some VR features or has decided a VR launch for those not present at the event, just like OnePlus did in the past.
The company is expected to launch two models – Galaxy S7 and the Galaxy S7 Edge. However, one can also expect a third model – a larger curvy variant dubbed Galaxy S7 edge+. Seems like all three smartphones may come with the same hardware, with the only differentiator being the display size and form factor. The standard S7 is expected to pack in a flat display, while the S7 edge and the edge+ are expected to pack in a dual-edged curved display. According to the rumours so far, all the three variants are expected to sport a Quad HD resolution.
As for the internals of the Samsung Galaxy S7 and its siblings, they are expected to utilise chipsets coming from both Samsung and Qualcomm. The Samsung chipset in question is the Exynos 8890, while the Qualcomm variants would pack in the Snapdragon 820 chipset. It was recently revealed that Samsung itself will be building the chipsets for Qualcomm.
These devices are very crucial for Samsung as the company struggles for a firm foothold over markets.